Case studies
Innovating and automating
large-scale manufacture
The customers requested a solution to automate the bottle sorting section of their production line. The line involved a number of variations in bottle sizes and shapes. This AIR original design involves…
The aim of this project was to implement new technologies to improve the efficiency and simplify the palletizing process of boxed product. One challenge was to achieve the end goal but still minimize the…
Developing new metrology or inspection technologies for an advanced semiconductor fab is a very complex endeavor requiring specialized knowledge and significant capital expense. A European startup needed…
A tier 1 semiconductor OEM needed a custom solution for precise spin coating, cleaning and drying of a special liquid on a wafer mounted on a film frame to enable a downstream process. There were no off-the-shelf…
Backside contamination inspection and other process advancements require wafers to be loaded into process or inspection chambers in a 90° or 180° flipped orientation. Adding a wrist to a robot can meet…
The client needed to upgrade a mature gas waste abatement system while incorporating features from two recently acquired products with different designs and components. Internal engineering resources were…
The OEM needed to implement multiple bonding technologies into a small-footprint, wet environment platform. Wafer cleaning, drying, alignment, and joining mechanisms had to be robust, non-particle generating,…
The customer needed to deliver their confocal IR laser scanning technology on a fully automated 300 mm platform. Developing in-house automation would have diverted engineering resources and delayed commercialization….
The MoCVD deposition process is critical to HBLED manufacturing, with tightly constrained carrier pockets and strict no-contact requirements on both wafer sides. Manual loading could not meet throughput…
The OEM needed to transition a lab-demonstrated wafer probe process to a production-ready, fully 300 mm-compliant automation platform. The system required micron-level wafer positioning, exceptional positional…
The OEM needed a macro defect inspection module that integrated seamlessly with their wafer sorter. The module had to enable front- and back-side visual inspection under uniform illumination, meet stringent…
Next-generation process and device technologies demanded new measurement tools, but fabs require fully automated 300 mm configurations for evaluation. Our client needed a high-vacuum wafer automation platform…