Precision wafer probe automation for 32 nm nanotech devices
Project snapshot
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Challenge
Automate ultra-precise wafer probing on a 300 mm platform
The OEM needed to transition a lab-demonstrated wafer probe process to a production-ready, fully 300 mm-compliant automation platform. The system required micron-level wafer positioning, exceptional positional stability, and handling of extremely small samples—all while meeting SEMI safety and EMI standards.
Innovation
High-stability, multi-axis automation with integrated vision
We developed a wafer probe automation platform that combined precision, stability, and full 300 mm compliance. Key features included:
- Eight-axis high-performance staging with ultra-rigid bridge design for vibration isolation.
- Vision-based wafer positioning and low-level software libraries for precise machine control.
- Clean airflow management, EFEM integration, and custom end effector design.
- Fully compliant with SEMI safety and EMI standards.
- Integrated frame, panels, and electrical packaging for production readiness.
Result
Rapid commercialization and ongoing production support
The platform successfully transitioned the OEM’s lab process to production, providing precise wafer probing for 32 nm devices. We also supported ongoing manufacturing, final test, and direct drop shipment to end customers, ensuring rapid deployment and reliable throughput.
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Case studies
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