Case studies
Innovating and automating
large-scale manufacture
The rapid growth of the HBLED market required laser equipment manufacturers to increase wafer dicing throughput, reduce costs, and replace mechanical dicing technologies. To meet the market window, the…
Our client’s revolutionary CO₂ cleaning technology removes micron and submicron particulate and organic contamination, but to be evaluated by a leading-edge fab, it needed to be implemented on a fully…
The customer needed a 30% reduction in tool cost while implementing improvements in process technology. The effort had to be low-risk, ensuring no process-critical components were affected, and the first…
Wet cleaning remains one of the few batch processes in the modern fab. The client had developed a single wafer cleaning process for low-K materials and delicate structures that are highly sensitive to…
Interoperability—running any manufacturer’s FOUP without adjustment—was not being met by current load ports. MTBF targets of 2+ years, compliance with emerging factory automation standards, and tight…
A leading semiconductor automation manufacturer needed to quickly cost reduce their vacuum robot design, which required a total redesign of the mechanisms below the mounting plate. Time was critical as…
The CMP equipment manufacturer needed a wafer load station to interface with their polishing process. The first design partner failed to deliver, leaving the schedule nearly exhausted and no usable design….
Manual handling of polysilicon rods caused yield loss due to breakage and contamination. Rod diameters varied widely and spacing was tight, creating a mechanical challenge. The manufacturing environment…
A pioneer in manual wafer scribing and dicing needed to scale their process from 4" to 8" wafers. Their unique approach required the wafer to “float” so that scribing could be accurate and breakage…
A major HDD manufacturer needed to improve the reliability and cleanliness of their media scrubber modules without replacing the entire cleanline. Existing automation dropped disks frequently, had low…
Our client had developed a semiconductor wafer process that needed to be adapted for hard disk media. The HDD manufacturing environment demanded much higher throughput, different form factors, and unique…
A major hard disk manufacturer had developed a lab-scale UV processing technology and needed to scale it to high-volume production. The system had to handle media at high speed, integrate seamlessly with…