Automated wafer loading for high-brightness LED MoCVD carriers
Project snapshot
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Challenge
Automate precise, non-contact wafer loading for HBLED deposition
The MoCVD deposition process is critical to HBLED manufacturing, with tightly constrained carrier pockets and strict no-contact requirements on both wafer sides. Manual loading could not meet throughput demands or ensure consistent placement. Automation needed to achieve perfect alignment without touching the wafer surfaces while maintaining carrier integrity.
Innovation
Precision Bernoulli-based wafer transfer with vision guidance
We developed a fully automated cassette loading and wafer transfer system leveraging:
- A custom Bernoulli end effector to hold wafers without front or backside contact.
- Machine vision for precise alignment within the tight carrier pockets.
- High-precision mechanics to ensure repeatable, accurate placement.
- Integration with existing HBLED MoCVD carriers without any modification.
Result
Reliable, high-throughput HBLED wafer handling
The automation system successfully delivered non-contact, precision wafer loading, enabling higher throughput and consistent deposition quality for larger HBLED wafers. The solution reduced manual labor and safeguarded critical carrier and wafer integrity.
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