A custom semiconductor solution for spin coating wafers on film frames
Challenge
Create a custom spin coating system on a tight timeline
A tier 1 semiconductor OEM needed a custom solution for precise spin coating, cleaning and drying of a special liquid on a wafer mounted on a film frame to enable a downstream process. There were no off-the-shelf systems available, and the OEM’s team did not have the time or expertise to develop a solution. Spinning film frames at high speeds pose vibration, run-out, acceleration/deceleration, and servo-control challenges that any design must overcome.
Innovation
A close design collaboration for a rapid, precise delivery
We worked with the OEM’s team onsite to understand the process requirements and challenges. With this close collaboration, the first system was designed and built in less than six months. We worked with the client team to successfully create and deliver the following design features:
- Omnidirectional speed of 2,500 RPM (+/-2)
- Calibrated with the motion of the dispensing arms
- Liquid dispensed at a precise rate
- Chamber designed to contain liquid
- Chamber designed to avoid liquid bouncing off the side wall onto the wafer
- Secondary process to provide megasonic cleaning and infrared drying
Result
Record time for a critical product launch
The system was accepted in record time, enabling the customer to support the launch of a critical new product.
Featured capabilities:
Featured sectors:
Case studies
The OEM needed to implement multiple bonding technologies into a small-footprint, wet environment platform. Wafer cleaning, drying, alignment, and joining mechanisms had to be robust, non-particle generating,…
Backside contamination inspection and other process advancements require wafers to be loaded into process or inspection chambers in a 90° or 180° flipped orientation. Adding a wrist to a robot can meet…
The customer needed to deliver their confocal IR laser scanning technology on a fully automated 300 mm platform. Developing in-house automation would have diverted engineering resources and delayed commercialization….