High-throughput vacuum metrology platform for 300mm wafers
Project snapshot
Client:
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Challenge
Transition bench-top measurement technology into a fully automated production-ready platform
Next-generation process and device technologies demanded new measurement tools, but fabs require fully automated 300 mm configurations for evaluation. Our client needed a high-vacuum wafer automation platform that could integrate reliably with their measurement module. Cost, throughput, and rapid delivery were critical to meet the tight market window.
Innovation
Custom high-vacuum wafer automation integrated with metrology module
We collaborated with the client to develop a vacuum metrology platform that maximized throughput while maintaining reliability and cost-effectiveness. Key innovations included:
- System architecture optimized for measurement time, vacuum pump-down, and throughput.
- Selection and integration of vacuum robot, vacuum components, and EFEM to meet performance requirements and long lead-time constraints.
- Detailed frame, vacuum chamber, and power system design tailored to the client’s measurement technology.
- Full system integration including vacuum pump-down, handling reliability testing, and throughput verification.
Result
Production-ready vacuum metrology system delivered on schedule
The platform successfully integrated the client’s measurement technology into a reliable, cost-effective, fully automated 300 mm wafer system. Throughput, vacuum performance, and handling reliability met the design targets, enabling rapid adoption and market entry.
Case studies
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