Accelerated wafer film frame handling for laser dicing
Project snapshot
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Challenge
Deliver fully automated wafer film frame handling on an expedited schedule
The rapid growth of the HBLED market required laser equipment manufacturers to increase wafer dicing throughput, reduce costs, and replace mechanical dicing technologies. To meet the market window, the manufacturer needed a fully automated wafer film frame handling solution but developing it in-house would have required ramping up a team, learning the unique handling challenges, and risking unproven technology.
Innovation
Custom modular automation integrated with laser dicing system
We partnered with the client to develop a fully automated film frame handling module that integrated seamlessly with their laser dicing system. Key innovations included:
- Support for multiple cassette sizes and orientations (horizontal or vertical).
- Pre-alignment of wafer film frames for accurate handling.
- Modular frame design matching the aesthetic and footprint of the laser module.
- High-speed, reliable automation engineered to meet the client’s aggressive market timeline.
Result
On-time delivery enabled market leadership
The fully automated wafer film frame handling module was delivered on schedule, allowing the client to meet the critical market window and focus on their core laser dicing technology.
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